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Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection

Product Details
Brand Name: Suntek
Model Number: FPA8569-NE4
Place of Origin: China
Certification: ISO9001, ISO13485, TS16949 and UL E476377
Minimum Order: 5pcs
Price: USD+1-100+PCS
Payment Terms: T/T,Paypal
Supply Ability: 100pcs/hour
Delivery Time: 3-6 weeks
Packaging Details: cartons and ESD bags
Minimum Hole Size: 0.2mm
Layers: 2-20 Layers
Maximum Copper Weight: 6oz
Application: Electric Vehicles, Renewable Energy Systems, Energy Storage Systems
Lead Time: 3-5 Days after all components collected
Testing: AOI,ICT,100% Visual Inspection,FT
Type: Printed Circuit Board Assembly
Minimum Trace/Space: 4mil/4mil
Verfied Supplier
Suntek Electronics Co., Ltd. [ Changsha, China ] Verified Supplier
Business Type:Manufacturer
Exporter
Brands:Suntek,BLSuntek
Annual Sales:>15million
  Supplier`s last login times: within 1 hours
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